Our work and paper on electro-migration based reliability analysis has been nominated as the Best Paper Award candidate in the coming IEEE/ACM Design Automation Conference, which is the primary design technology conference in the semiconductor and EDA industry.

X. Huang, T. Yu,  V. Sukharev,  S. X.-D. Tan, Physics-based electromigration assessment for power grid networks, Proc. IEEE/ACM Design Automation Conference (DAC'14),  San Francisco, June, 2014. (Best Paper Award Nomination (12 out of 787 submissions, 1.5%))